These materials – commonly referred to as thermal pads or gap pads – come in a variety of heat conductive, thickness, pliability, and adhesion characteristics so that you can select the best solution for both heat dissipation and pad placement and fit. Pads also vary with regard to how conformable and compressible they are – important considerations when designing cooling solutions that require contact with a heat sink like a case enclosure. Many of these materials are reinforced (such as with fiberglass) for increased shear and tear resistance. And many come in silicone and silicone-free varieties. Because KLINGER IGI offers waterjet and die cut thermal gap pads, we can help you understand the best fabrication process for your selection of material.
KLINGER IGI stocks and sources a variety of materials for waterjet and die cut thermal gap pads.
These specialty electronics materials are available from top manufacturers like 3M, Parker Chomerics, Henkel (Bergquist), Schlegel, Kitagawa, Fuji, and others. Because KLINGER IGI sources thermal technologies from all of these companies, we can provide objective recommendations about the best performing, best delivery, and best price option for your needs. For example, if you need a pad that places low stress on components and boards during assembly, we know of several options that exhibit the desired conformable characteristics for interfacing with surfaces of varying smoothness or topography. And if you need that particular style of a thermally conductive pad in production volumes quickly or at a low price point, our team knows exactly the product to recommend. In short, because we are the material converter and make your part from the material selected, our approach is one of 'material agnosticism' – that is, we will recommend the best solution unswayed by a particular material manufacturer's marketing hype. Our role as a material converter assures you are offered waterjet and die cut thermal pads that satisfy your product specifications, cost goals, and delivery times.
As a top material converter, KLINGER IGI specializes in build-to-print parts.
We use our precision cutting equipment to form the selected materials into shapes that meet your strict design requirements. Because these materials provide excellent handling characteristics, they can be die cut, waterjet cut, flash cut, and kiss cut to tight tolerance to create the exact package that best supports your electronics product manufacturing requirements.
We can make something that you've already designed. We can work with your engineers to help you take your idea to prototype then production.
Either way, and at any stage, you'll find that our application, quality, and sales engineers maintain a focus on the technical aspects of product selection, implementation and usage. That's because we know how important those factors are to your engineering system, component discovery, and production sourcing efforts.
So, we welcome you to take advantage of our extensive knowledge of these high tech materials as well as our objectivity concerning the various material manufacturer's capabilities and limitations.
Please contact us to learn more about your material options and how your selection of a fabrication method can impact quality, delivery, and cost of waterjet and die cut thermal pads.